Oxalyl fluoride

Oxalyl fluoride is a fluorinated derivative of oxalic acid. It is being investigated for use in etching as a replacement for compounds which have the liability of high global warming potential.[1][2]

Oxalyl fluoride
Structural formula of oxalyl fluoride
Ball-and-stick model of oxalyl fluoride
Names
Preferred IUPAC name
Oxalyl difluoride
Systematic IUPAC name
Ethanedioyl difluoride
Other names
Oxalyl fluoride
Identifiers
3D model (JSmol)
ChemSpider
ECHA InfoCard 100.006.029
EC Number
  • 206-630-4
Properties
C2F2O2
Molar mass 94.017 g/mol
Melting point −3 °C (27 °F; 270 K)
Boiling point 26.6 °C (79.9 °F; 299.8 K)
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa).
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Infobox references

See also

References

  1. Method of etching and cleaning using fluorinated carbonyl compounds, US Patent 6635185.
  2. Simon Karecki; Ritwik Chatterjee; Laura Pruette; Rafael Reif; Terry Sparks; Laurie Beu; Victor Vartanian & Konstantin Novoselovc (2001). "Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool". J. Electrochem. Soc. 148 (3): G141–G149. doi:10.1149/1.1348263.


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