Oxalyl fluoride
Oxalyl fluoride is a fluorinated derivative of oxalic acid. It is being investigated for use in etching as a replacement for compounds which have the liability of high global warming potential.[1][2]
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Names | |||
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Preferred IUPAC name
Oxalyl difluoride | |||
Systematic IUPAC name
Ethanedioyl difluoride | |||
Other names
Oxalyl fluoride | |||
Identifiers | |||
3D model (JSmol) |
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ChemSpider | |||
ECHA InfoCard | 100.006.029 | ||
EC Number |
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PubChem CID |
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CompTox Dashboard (EPA) |
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Properties | |||
C2F2O2 | |||
Molar mass | 94.017 g/mol | ||
Melting point | −3 °C (27 °F; 270 K) | ||
Boiling point | 26.6 °C (79.9 °F; 299.8 K) | ||
Except where otherwise noted, data are given for materials in their standard state (at 25 °C [77 °F], 100 kPa). | |||
verify (what is ?) | |||
Infobox references | |||
See also
- Oxalyl chloride
- Oxalyl bromide
- Dioxane tetraketone
- Oxalyl
References
- Method of etching and cleaning using fluorinated carbonyl compounds, US Patent 6635185.
- Simon Karecki; Ritwik Chatterjee; Laura Pruette; Rafael Reif; Terry Sparks; Laurie Beu; Victor Vartanian & Konstantin Novoselovc (2001). "Evaluation of Oxalyl Fluoride for a Dielectric Etch Application in an Inductively Coupled Plasma Etch Tool". J. Electrochem. Soc. 148 (3): G141–G149. doi:10.1149/1.1348263.
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