List of Intel Core M processors

Intel Core M is a family of ultra low-voltage microprocessors belonging to the Intel Core series and designed specifically for ultra-thin notebooks, 2-in-1 detachables, and other mobile devices. The thermal design power (TDP) of all Core M microprocessors is 4.5 watts or lower. Intel Core M microprocessors are fanless due to their low TDP.

Broadwell microarchitecture (5th generation)

"Broadwell-Y" (SoC, dual-core, 14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
• All models except M-5Y10a and M-5Y70 support Configurable TDP.
• M-5Y70 and M-5Y71 also support Intel vPro.
• GPU and memory controller (up to 2 × DDR3-1600) are integrated onto the processor die.
• Peripherals include 12 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
• Package size: 30 mm × 16.5 mm
• Transistors: 1.3 billion
• Die size: 82 mm²

Model number	sSpec number	Cores	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)
Core M-5Y10 [2]	SR217 (E0)	2	800 MHz	2 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	100–800 MHz	4.5 W	BGA-1234	DMI 2.0	September 2014	FH8065801879602	$281
Core M-5Y10a	SR218 (E0)	2	800 MHz	2 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	100–800 MHz	4.5 W	BGA-1234	DMI 2.0	September 2014	FH8065801988602	$281
Core M-5Y10c	SR23C (F0)	2	800 MHz	2 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	300–800 MHz	4.5 W	BGA-1234	DMI 2.0	October 2014	FH8065802062002	$281
Core M-5Y31	SR23G (F0)	2	900 MHz	2.4 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	300–850 MHz	4.5 W	BGA-1234	DMI 2.0	October 2014	FH8065802061902	$281
Core M-5Y51	SR23L (F0)	2	1.1 GHz	2.6 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	300–900 MHz	4.5 W	BGA-1234	DMI 2.0	October 2014	FH8065802061802	$281
Core M-5Y70	SR216 (E0)	2	1.1 GHz	2.6 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	100–850 MHz	4.5 W	BGA-1234	DMI 2.0	September 2014	FH8065801875604	$281
Core M-5Y71	SR23Q (F0)	2	1.2 GHz	2.9 GHz	2 × 256 KiB	4 MiB	HD Graphics 5300	300–900 MHz	4.5 W	BGA-1234	DMI 2.0	October 2014	FH8065802061602	$281

Skylake microarchitecture (6th generation)

"Skylake-Y" (SoC, dual-core, 14 nm)

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
• m5-6Y57 and m7-6Y75 also support Intel vPro, Intel TXT.
• GPU and memory controller (up to 2 × DDR3-1866) are integrated onto the processor die.
• Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
• Package size: 20 mm × 16.5 mm
• Transistors: TBD
• Die size: TBD

Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)
Core m3-6Y30	SR2EN (D1)	2 (4)	900 MHz	2.2 GHz	2 × 256 KiB	4 MiB	HD Graphics 515	300–850 MHz	4.5 W	BGA 1515	DMI 3.0	September 2015	HE8066201930521	$281
Core m5-6Y54	SR2EM (D1)	2 (4)	1.1 GHz	2.7 GHz	2 × 256 KiB	4 MiB	HD Graphics 515	300–900 MHz	4.5 W	BGA 1515	DMI 3.0	September 2015	HE8066201930524	$281
Core m5-6Y57	SR2EG (D1)	2 (4)	1.1 GHz	2.8 GHz	2 × 256 KiB	4 MiB	HD Graphics 515	300–900 MHz	4.5 W	BGA 1515	DMI 3.0	September 2015	HE8066201922876	$281
Core m7-6Y75	SR2EH (D1)	2 (4)	1.2 GHz	3.1 GHz	2 × 256 KiB	4 MiB	HD Graphics 515	300–1000 MHz	4.5 W	BGA 1515	DMI 3.0	September 2015	HE8066201922875	$393

Kaby Lake microarchitecture (7th/8th generation)

"Kaby Lake-Y" (SoC, dual-core, 14 nm)

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

• All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
• GPU and memory controller (up to 2 × LPDDR3-1866) are integrated onto the processor die.
• Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
• Package size: 20 mm × 16.5 mm
• Transistors: TBD
• Die size: TBD

Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)
Core m3-7Y30	SR2ZY (H0) SR347 (H0)	2 (4)	1 GHz	2.6 GHz	2 × 256 KiB	4 MiB	HD Graphics 615	300–900 MHz	4.5 W	BGA 1515	DMI 3.0	September 2016	HE8067702739824	$281
Core m3-7Y32	SR346 (H0)	2 (4)	1.1 GHz	3.0 GHz	2 × 256 KiB	4 MiB	HD Graphics 615	300–900 MHz	4.5 W	BGA 1515	DMI 3.0	April 2017	HE8067702739830	$281

"Amber Lake-Y" (dual-core, 14 nm)

Model number	sSpec number	Cores (threads)	Frequency	Turbo	L2 cache	L3 cache	GPU model	GPU frequency	TDP	Socket	I/O bus	Release date	Part number(s)	Release price (USD)
Core m3-8100Y	SRD23 (H0)	2 (4)	1.1 GHz	3.4 GHz	2 × 256 KiB	4 MiB	HD Graphics 615	300–900 MHz	5 W	BGA 1515	DMI 3.0	August 2018	HE8067702739859	$281

See also

• System on a chip (SoC)

References

1. "Product Change Notification : # 113203 - 00" (PDF). Qdms.intel.com. Retrieved 24 January 2019.
2. "Product Change Notification : # 113203 - 00" (PDF). Qdms.intel.com. Retrieved 24 January 2019.

External links

• Intel Core M Processors Product Order Code Table
• Intel processor price list
• Intel 14nm technology